The bond of prestressing wires in Hoyer’s system can be formed by ___________

The bond of prestressing wires in Hoyer’s system can be formed by ___________ Correct Answer Helical crimping

Bond of prestressing wires may be considerably improved by forming surface indentations and by helical crimping of wires in Hoyer’s system, strands have considerable better bond characteristics than plain wires of equal cross sectional area supplementary anchoring devices are required when single wires of larger diameter are used in the pretensioned units.
Bissoy MCQ

Related Questions

The Hoyer’s system of prestressing proves to be economical for ___________
The Hoyer’s method of prestressing is done by ___________