In chemo-mechanical polishing (CMP) process, material is removed due to abrading.

In chemo-mechanical polishing (CMP) process, material is removed due to abrading. Correct Answer True

CMP uses both chemical and mechanical type for material removal mechanism. Chemical reaction is used to soften material and then mechanically polish off this layer. Mechanical removal takes place due to abrading.

Related Questions

What is removed during polishing?