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A multi-chip module is generically an electronic assembly where multiple integrated circuits , semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "Heterogeneous integration" or "Hybrid Integrated Circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
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