In pure metals solidification is controlled by the rate at which the latent heat of solidification can be conducted away from the solid/liquid interface. Which among the following equation satisfies the heat flow and the interface stability? (Kl, Ks are respective thermal conductivities of liquids and solids, L the latent heat of fusion per unit volume, v growth rate).

In pure metals solidification is controlled by the rate at which the latent heat of solidification can be conducted away from the solid/liquid interface. Which among the following equation satisfies the heat flow and the interface stability? (Kl, Ks are respective thermal conductivities of liquids and solids, L the latent heat of fusion per unit volume, v growth rate). Correct Answer KsTs = Kl*Tl +v*L

KsTs = Kl*Tl +v*L, the heat flow away from the interface through the solid must balance that from the liquid plus the latent heat generated at the interface. This equation is quite general for a planar interface and even holds when heat is conducted into the liquid.
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